Skip to main content
Macnica Cytech 駿龍科技有限公司
 Global Network Contact Us
Languages
  • 中文簡体
  • 中文繁體
  • English

Menu

  • Home
  • About Us
    • Company Profile
    • Global Network
    • Mpression Solutions
    • Disclaimer
    • Privacy Policy
  • Products
    • Analog Devices
    • Beijing Tsing Micro Technology
    • Dialog
    • Dosilicon
    • Halo Electronics
    • Infineon
    • Intel
    • Macnica Cytech
    • Micron
    • MinebeaMitsumi
    • MotorComm
    • NanJing Guanxu New Materials Technology
    • Nvidia
    • Parade
    • Renesas
    • Tempo Semiconductor
    • Xinyi Information Technology
    • Xsens
  • Dev Kits
    • 2019 EtherCAT Master Solution Summary
    • Arria 10 SoC module solution: Silic
    • Borax SOM
    • EasyGX Board
    • EtherCAT Master ASSP Chip
    • EtherCAT Slave + FOC Solution
    • Helio Board
    • Industrial Camera Module
    • ME10 SoC - 4K AV over 1GbE System on Chip
    • MIE SoC module
    • RF Solution
  • News & Events
    • News
    • Events
  • Articles & Videos
    • Technical Articles
  • Contact
    • Contact Form
    • Domestic Locations
    • Global Locations
    • Social Media
  •  
  • Dosilicon
 Back to Top

Sidebar Menu

  • Home
  • About Us
    • Company Profile
    • Global Network
    • Mpression Solutions
    • Disclaimer
    • Privacy Policy
  • Products
    • Analog Devices
    • Beijing Tsing Micro Technology
    • Dialog
    • Dosilicon
    • Halo Electronics
    • Infineon
    • Intel
    • Macnica Cytech
    • Micron
    • MinebeaMitsumi
    • MotorComm
    • NanJing Guanxu New Materials Technology
    • Nvidia
    • Parade
    • Renesas
    • Tempo Semiconductor
    • Xinyi Information Technology
    • Xsens
  • Dev Kits
    • 2019 EtherCAT Master Solution Summary
    • Arria 10 SoC module solution: Silic
    • Borax SOM
    • EasyGX Board
    • EtherCAT Master ASSP Chip
    • EtherCAT Slave + FOC Solution
    • Helio Board
    • Industrial Camera Module
    • ME10 SoC - 4K AV over 1GbE System on Chip
    • MIE SoC module
    • RF Solution
  • News & Events
    • News
    • Events
  • Articles & Videos
    • Technical Articles
  • Contact
    • Contact Form
    • Domestic Locations
    • Global Locations
    • Social Media

Dosilicon

Dosilicon 东芯半导体

Dosilicon 东芯半导体

Dosilicon

Dosilicon is a Fabless chip company focusing on the design, production and sales of small and medium-capacity NAND, NOR flash memory chips, DRAM memory and MCP. It is currently one of the few domestic companies that can provide both NAND/NOR/DRAM/MCP design processes and product solutions.

  •  Supplier Website
  • For more information:

    •   Contact Us

    Copyright 2022 Macnica Cytech Limited

    粤ICP备2021107379号-1

    LoginLogout

    Sitemap

    • Home
    • About Us
      • Company Profile
      • Global Network
      • Mpression Solutions
      • Disclaimer
      • Privacy Policy
    • Products
      • Analog Devices
      • Beijing Tsing Micro Technology
      • Dialog
      • Dosilicon
      • Halo Electronics
      • Infineon
      • Intel
      • Macnica Cytech
      • Micron
      • MinebeaMitsumi
      • MotorComm
      • NanJing Guanxu New Materials Technology
      • Nvidia
      • Parade
      • Renesas
      • Tempo Semiconductor
      • Xinyi Information Technology
      • Xsens
    • Dev Kits
      • 2019 EtherCAT Master Solution Summary
      • Arria 10 SoC module solution: Silic
      • Borax SOM
      • EasyGX Board
      • EtherCAT Master ASSP Chip
      • EtherCAT Slave + FOC Solution
      • Helio Board
      • Industrial Camera Module
      • ME10 SoC - 4K AV over 1GbE System on Chip
      • MIE SoC module
      • RF Solution
    • News & Events
      • News
      • Events
    • Articles & Videos
      • Technical Articles
    • Contact
      • Contact Form
      • Domestic Locations
      • Global Locations
      • Social Media

    Cytech WeChat
    WeChat Platform

    Cytech FPGA WeChat
    FPGA WeChat Platform

    LinkedIn
    LinkedIn