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Dialog Semiconductor Launches TINY Bluetooth® Low Energy SoC and Module to Connect Next Billion IoT Devices
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Dialog Semiconductor Launches TINY Bluetooth® Low Energy SoC and Module to Connect Next Billion IoT Devices |
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ADI公司收购Test Motors，扩展面向工业4.0的机器状态监控方案
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ADI公司收购Test Motors，扩展面向工业4.0的机器状态监控方案 |
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美光利用全球最快的 SSD 將 3D XPoint™ 技術推向市場
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美光利用全球最快的 SSD 將 3D XPoint™ 技術推向市場 |
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美光科技宣布推出新款企业级和消费级 SSD，为存储全球数据拓宽选择
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美光科技宣布推出新款企业级和消费级 SSD，为存储全球数据拓宽选择 |
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IDT Offers Complete Portfolio of PCIe Gen5 Clocking Solutions for Datacenter and Network Infrastructure
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IDT Offers Complete Portfolio of PCIe Gen5 Clocking Solutions for Datacenter and Network Infrastructure |
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IDT Announces Fully Integrated All-In-One Biosensor Module for Mobile and Wearable Devices
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IDT Announces Fully Integrated All-In-One Biosensor Module for Mobile and Wearable Devices |
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英特尔® 至强® 可扩展处理器加速阿里云大数据计算
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英特尔® 至强® 可扩展处理器加速阿里云大数据计算 |
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Intel Enables AI Acceleration and Brings New Pricing to Intel Xeon W and X-Series Processors
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Intel Enables AI Acceleration and Brings New Pricing to Intel Xeon W and X-Series Processors |
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Infineon Technologies AG starting bookbuilding process for inaugural dual-tranche EUR perpetual hybrid bond
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Infineon Technologies AG starting bookbuilding process for inaugural dual-tranche EUR perpetual hybrid bond |
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Dialog Semiconductor Launches Configurable, High-Frequency Sub-PMICs Powering Latest Mobile Processors
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Dialog Semiconductor Launches Configurable, High-Frequency Sub-PMICs Powering Latest Mobile Processors |
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